Comprar ACCESSORIES-PLASTIC COVER 1.3 con BYCHPS
Compre con garantía
ACCESSORIES-PLASTIC COVER 1.3
- Número de pieza:
- ACCESSORIES-PLASTIC COVER 1.3
- Fabricante:
- Schaffner EMC, Inc.
- Descripción:
- COVER TERM PLAS FN3270 800/1000A
- Estado Libre de plomo / Estado RoHS:
- Sin plomo / Cumple con RoHS
- Cantidad disponible:
- 13635 Pieces
- Ficha de datos:
- ACCESSORIES-PLASTIC COVER 1.3.pdf
Introducción
BYCHIPS es el distribuidor de almacenamiento para ACCESSORIES-PLASTIC COVER 1.3, tenemos las existencias para el envío inmediato y también está disponible para el suministro de larga duración. Por favor envíenos su plan de compra para ACCESSORIES-PLASTIC COVER 1.3 por correo electrónico, le ofreceremos el mejor precio según su plan.
Especificaciones
| Serie: | - |
|---|---|
| Otros nombres: | 1151-049 806275 817-1767 ACCESSORIES-PLASTIC COVER 1.3-ND ACCESSORIES-PLASTICCOVER1.3 ACCESSORIES-PLASTICCOVER1.3-ND ACCESSORIESPLASTICCOVER13 |
| Nivel de Sensibilidad a la Humedad (MSL): | 1 (Unlimited) |
| Tiempo de entrega estándar del fabricante: | 10 Weeks |
| Número de pieza del fabricante: | ACCESSORIES-PLASTIC COVER 1.3 |
| Para uso con / Productos relacionados: | FN3270 Series |
| Descripción: | COVER TERM PLAS FN3270 800/1000A |
| Tipo de accesorio: | Cover |
| Email: | [email protected] |
partes relacionadas de ACCESSORIES-PLASTIC COVER 1.3
| Imagen | Número de pieza | Fabricantes | Descripción | Ver |
|---|---|---|---|---|
 |
ACCESSORIES-PLASTIC COVER 2.2 | Schaffner EMC Inc. | COVER TERM PLAS FN3359 250A | Investigación |
 |
ACCESSORIES-PLASTIC COVER 1.1 | Schaffner EMC Inc. | COVER TERM PLAS FN3270 150-600A | Investigación |
 |
ACCESSORIES-PLASTIC COVER 2.3 | Schaffner EMC Inc. | COVER TERM PLAS FN3359 320/400A | Investigación |
 |
ACCESSORIES-PLASTIC COVER 2.4 | Schaffner EMC Inc. | COVER TERM PLAS FN3359 600A | Investigación |
 |
ACCESSORIES-PLASTIC COVER 2.5 | Schaffner EMC Inc. | COVER TERM PLAS FN3359 800/1000A | Investigación |
 |
ACCESSORIES-PLASTIC COVER 2.1 | Schaffner EMC Inc. | COVER TERM PLAS FN3359 150/180A | Investigación |
Latest Noticias
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers
- Texas Instruments names Haviv Ilan senior vice president of High Performance Analog